MF55 thin film Pl package chip type NTcthermistor

Detail Inquiry

Unit

D

L

E

F

ϕOD

G

mm

2.0

4.0

28

60

0.5

/

 

FEATURES INTRODUCTION

1.MF5B series products are in the same direction lead PI film package type

2.Insulating film packaging,fast heat induction speed

3.Good stability and high reliability

4.Good insulation and light weight

5.High resistance accuracy

6.Volume flake,thickness 0.15mm

7.Temperature range-40~125℃

8.Responsive 3S

SCOPE OF APPLICATION

Cervical massager,heating knee pads,copiers,notebook heat dissipation,medicalequipment and equipment,new energy vehicle charging piles,etc.are commonlyused in office,life,and medical fields

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